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NXP's BGM220 complete WLAN solution offers a small footprint and ultra-low power consumption in an 81-pin TFBGA package.
Billed by NXP as the world's smallest complete WLAN solution, the BGM220 it integrates RF and Baseband/MAC in a single package. It has been optimized for handheld applications such as feature phones and smartphones, handheld game consoles and PDAs.
The BGM220 also provides extended wireless access by enabling simultaneous Bluetooth and WLAN connectivity.
It builds on its predecessor, the BGW211 in its RF/baseband integration but also offers a significantly smaller form factor and highly optimized dynamic power management. It comes in a single 5mm by 5mm TFBGA package that supports the SDIO/SPI host interfaces.
Using industry-proven silicon from NXP's existing products, the BGM220 provides OEMs with a range of benefits, such as low-cost implementation, enhanced performance and flexibility to provide additional cost/performance tradeoffs, while also helping speed time to market.
BGM220 reference designs include NXP's PMU for advanced power management functionality and validated front-end modules through NXP's partnership with selected module manufacturers. The BGM220 facilitates a sub 100mm2 full, semi-discrete WLAN system implementation providing a best-in-class combination of price and size for our OEM customers.
"The proliferation of wireless networks is enabling manufacturers to develop new and engaging multimedia devices for a range of different end users," said Paul Marino, vice president and general manager, Business Line Connectivity, NXP Semiconductors. "NXP is committed to delivering new and insightful solutions to empower the design of these innovative products in the future."
The BGM220 meets key WFA interoperability requirements including WPA2 and WMM and supports all relevant enterprise security requirements with CCX extensions. It has driver support for all major operating systems, including Windows Mobile, Windows CE, Symbian and Linux, and is designed to support a single antenna for Bluetooth and WLAN.
The BGM220 will be available for sampling during the second quarter of 2007, and mass production will begin during the fourth quarter of 2007.
More information is available at www.nxp.com.
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